Mizuho Raises TSMC's CoWoS Capacity Estimates

Mizuho Research has raised its capacity estimates for TSMC's CoWoS (Chip-on-Wafer-on-Substrate) technology. The new report suggests that the company's production capacity in the advanced packaging segment will increase compared to previous expectations. The upgrade indicates that TSMC's CoWoS production volumes will grow by 15% to 20% for 2024 and 2025. Mizuho notes that this growth will be driven particularly by rising demand for high-performance processors and artificial intelligence applications. The analyst emphasized that the expansion of TSMC's CoWoS capacity will contribute to the company's overall revenue growth and strengthen its competitive advantage. Additionally, it was stated that flexibility in the supply chain and improvements in production efficiency could alleviate cost pressures. Mizuho's updated estimates offer a new perspective for investors and industry observers on the future of TSMC's advanced packaging strategy. This is not an investment recommendation.

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The news indicates that TSMC will increase its CoWoS packaging capacity in response to demand for artificial intelligence and high-performance computing. Although the RSI rising to 77 on technical indicators suggests that the overbought zone is approaching, the MACD being above the signal line and the price trading above the 20- and 50-day moving averages support the possibility of continued upward momentum in the short term. However, the sharp 8% rise in the last 24 hours and overbought signals also bring the risk of some profit-taking or consolidation in the near term. Therefore, the upside expectation is assessed with moderate confidence.

RSI 14

77.0

MACD

9.29

24h Δ

8.01%

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